JPS6172679A - 低熱膨脹セラミツクス焼結体 - Google Patents
低熱膨脹セラミツクス焼結体Info
- Publication number
- JPS6172679A JPS6172679A JP59192999A JP19299984A JPS6172679A JP S6172679 A JPS6172679 A JP S6172679A JP 59192999 A JP59192999 A JP 59192999A JP 19299984 A JP19299984 A JP 19299984A JP S6172679 A JPS6172679 A JP S6172679A
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- sintered body
- ceramic sintered
- coefficient
- cordierite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 26
- 229910052878 cordierite Inorganic materials 0.000 claims description 22
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 22
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- 229910052644 β-spodumene Inorganic materials 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 8
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052863 mullite Inorganic materials 0.000 claims description 6
- 229910052839 forsterite Inorganic materials 0.000 claims description 5
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052634 enstatite Inorganic materials 0.000 claims description 4
- BBCCCLINBSELLX-UHFFFAOYSA-N magnesium;dihydroxy(oxo)silane Chemical compound [Mg+2].O[Si](O)=O BBCCCLINBSELLX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052596 spinel Inorganic materials 0.000 claims description 4
- 239000011029 spinel Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 8
- 238000001125 extrusion Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000174 eucryptite Inorganic materials 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 238000000634 powder X-ray diffraction Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052642 spodumene Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59192999A JPS6172679A (ja) | 1984-09-14 | 1984-09-14 | 低熱膨脹セラミツクス焼結体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59192999A JPS6172679A (ja) | 1984-09-14 | 1984-09-14 | 低熱膨脹セラミツクス焼結体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6172679A true JPS6172679A (ja) | 1986-04-14 |
| JPH0463023B2 JPH0463023B2 (en]) | 1992-10-08 |
Family
ID=16300529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59192999A Granted JPS6172679A (ja) | 1984-09-14 | 1984-09-14 | 低熱膨脹セラミツクス焼結体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6172679A (en]) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265334B1 (en) * | 1997-10-24 | 2001-07-24 | Kyocera Corporation | Ceramic sintered product and process for producing the same |
| US6372677B1 (en) | 1999-04-06 | 2002-04-16 | Nippon Steel Corporation | Low thermal expansion and high rigidity ceramic sintered body |
| US6610620B1 (en) * | 1999-07-14 | 2003-08-26 | Minolta Co., Ltd. | Glass-ceramic composition for recording disk substrate |
| US7067085B1 (en) | 1999-06-29 | 2006-06-27 | Nippon Steel Corporation | Black ceramic sinter with low thermal expansion and high specific rigidity and process for producing the same |
| JP2008094711A (ja) * | 2006-09-14 | 2008-04-24 | Nippon Electric Glass Co Ltd | 封着材料 |
| JP2010247999A (ja) * | 2009-04-10 | 2010-11-04 | Nikko Co | 低温焼成高強度低熱膨張性磁器及びその製造方法 |
| JP2010254505A (ja) * | 2009-04-23 | 2010-11-11 | Nikko Co | 低温焼成高強度低熱膨張性磁器及びその製造方法 |
| US20170038148A1 (en) * | 2013-12-21 | 2017-02-09 | Kyocera Corporation | Heat exchange member and heat exchanger |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4988909A (en]) * | 1972-12-11 | 1974-08-26 | ||
| JPS60141667A (ja) * | 1983-12-28 | 1985-07-26 | 日本碍子株式会社 | セラミックハニカム構造体を接合若しくはコーティングまたは封着するためのセラミック材料組成物 |
-
1984
- 1984-09-14 JP JP59192999A patent/JPS6172679A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4988909A (en]) * | 1972-12-11 | 1974-08-26 | ||
| JPS60141667A (ja) * | 1983-12-28 | 1985-07-26 | 日本碍子株式会社 | セラミックハニカム構造体を接合若しくはコーティングまたは封着するためのセラミック材料組成物 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6265334B1 (en) * | 1997-10-24 | 2001-07-24 | Kyocera Corporation | Ceramic sintered product and process for producing the same |
| USRE39120E1 (en) * | 1997-10-24 | 2006-06-06 | Kyocera Corporation | Ceramic sintered product and process for producing the same |
| US6372677B1 (en) | 1999-04-06 | 2002-04-16 | Nippon Steel Corporation | Low thermal expansion and high rigidity ceramic sintered body |
| US7067085B1 (en) | 1999-06-29 | 2006-06-27 | Nippon Steel Corporation | Black ceramic sinter with low thermal expansion and high specific rigidity and process for producing the same |
| US6610620B1 (en) * | 1999-07-14 | 2003-08-26 | Minolta Co., Ltd. | Glass-ceramic composition for recording disk substrate |
| JP2008094711A (ja) * | 2006-09-14 | 2008-04-24 | Nippon Electric Glass Co Ltd | 封着材料 |
| JP2010247999A (ja) * | 2009-04-10 | 2010-11-04 | Nikko Co | 低温焼成高強度低熱膨張性磁器及びその製造方法 |
| JP2010254505A (ja) * | 2009-04-23 | 2010-11-11 | Nikko Co | 低温焼成高強度低熱膨張性磁器及びその製造方法 |
| US20170038148A1 (en) * | 2013-12-21 | 2017-02-09 | Kyocera Corporation | Heat exchange member and heat exchanger |
| US10697707B2 (en) * | 2013-12-21 | 2020-06-30 | Kyocera Corporation | Heat exchange member and heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0463023B2 (en]) | 1992-10-08 |
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